Patent News

Apple Supplier Toshiba set to open Next-Gen 3D BiCS FLASH Memory Plant in 2019

A last minute Bain Capital offer to acquire Toshiba’s Memory Chip business last year included Apple joining their bid. On June first the deal was officially completed. Last week the Financial Post reported that Toshiba has started construction on a next generation fab in Kitakami City, Japan. It will reportedly be completed by autumn 2019 dedicated to the production of its proprietary 3D flash memory known as BiCS FLASH. It’s a technology Apple may have their eye on for premium iPhones supporting 5G networks

View the original article here: Apple Supplier Toshiba set to open Next-Gen 3D BiCS FLASH Memory Plant in 2019

The article was originally posted on Patently Apple.
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