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Beyond Foldable Phones, Intel's new 'Lakefield' Platform will drive Different kinds of Next-Gen Foldable PC's

Both Samsung and Huawei introduced next generation foldable smartphones this month generating a lot of buzz across the media landscape. Consumers showed that they’re excited about the future of foldable smartphones once the price comes down to earth. Another company working on delivering next generation of foldable devices and new form factors is Intel with their next-gen Lakefield platform which will knock the doors wide open for badly needed innovation in the PC space that could further challenge smartphones and tablets that are both in decline.

View the original article here: Beyond Foldable Phones, Intel's new 'Lakefield' Platform will drive Different kinds of Next-Gen Foldable PC's

The article was originally posted on Patently Apple.
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